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Plating Equipment Engineer

Company: Broadcom Inc.
Location: Fort Collins
Posted on: June 26, 2019

Job Description:

JOB DESCRIPTION:

Description

As a Plating and Wet Etch Equipment Engineer with Broadcom's Wireless Semiconductor Division (WSD), you will be responsible for equipment used to develop advanced processes in our state of the art 6 and 8 wafer fabrication facility located along the Front Range Mountains in Northern Colorado. You will team with Technology Development and Process Engineering to achieve this objective. The team will be challenged by new materials, applications and device architectures. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before ramping them into high volume manufacturing. Fabrication technologies will include silicon based MEMS and compound semiconductor active devices. Primary focus will be on Electroplating equipment.

Responsibilities

* Provide technical leadership in identifying, evaluating, improving and maintaining equipment.

* New equipment selection, acceptance and start-up as well as hardware and software optimization; conferring with equipment vendors and manufacturing engineers at -Broadcom.

* Existing equipment upgrade and 6 8 tool conversion with qualification support.

* Develop and implement preventative, predictive and high precision maintenance procedures. Implementation includes documenting procedures, as well as training and certifying personnel.

* Work with peers and the unit process engineering/maintenance teams to establish project objectives, schedules and resource profiles for projects. Organizes and manages longer term improvement projects to meet organizational goals.

* Collaborate with Process Engineering, Equipment Maintenance and Manufacturing Operations to achieve robust performance in support of yield, quality, cost and productivity goals; reporting and ownership of related projects and metrics.

* Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching).

Job Qualifications

* BS in EE, ME, ChemE, Materials Science or a graduate degree in a technical field and a minimum of 5 years of experience as an engineer supporting Electroplating equipment in a MEMS/semiconductor environment.

* Experience with Electroplating equipment; AMAT Raider, Ancosys, Nexx equipment, highly preferred. Detail oriented with strong fundamentals in core equipment engineering functions.

* Excellent diagnostic and troubleshooting skills for process/equipment interactions.

* Practical experience applying structured problem solving methods.

* Working knowledge and practical experience with SPC, DOE and statistical hypothesis testing.

* Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access.

* Excellent verbal and written skills. Commitment to effective communication.

* Initiative to address and appropriately escalate problems to achieve rapid resolution.

* Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially.

* Basic understanding of MEMS and active device micro-fabrication techniques is highly desirable.

* Legal authorization to work in the US.

IF YOU ARE LOCATED OUTSIDE USA, PLEASE BE SURE TO FILL OUT A HOME ADDRESS AS THIS WILL BE USED FOR FUTURE CORRESPONDENCE.

Broadcom Inc. is committed to creating a diverse work environment and is proud to be an equal opportunity employer.

Keywords: Broadcom Inc., Denver , Plating Equipment Engineer, Engineering , Fort Collins, Colorado

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